UPW Application Degasification Ion-exchange UV

Download Full Article

Abstract

Wet cleaning processes continue to advance to meet the challenges of manufacturing semiconductor devices of ever-increasing performance and smaller geometries. The new materials, manufacturing processes, larger wafer size, aggressive dimension shrinks, and ESH (environmental, safety, and health) considerations will drive the development of new cleaning methods for both front-end-of-the-line (FEOL) and back-end-of-the-line (BEOL) cleaning processes. The role of high-purity water (deionized [DI] water) in these manufacturing processes is expanding from the traditional wafer rinsing to the more advanced applications.

Log in or Subscribe to Access the Full Article

To read or download full-length articles you need a subscription to Ultrapure. Please log in or subscribe below.