Wastewater Reuse Conductivity Membranes Reverse Osmosis

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Abstract

The production of semiconductor devices requires the use of large volumes of high-purity water. A study performed in 2000 indicates that freshwater withdrawals in California for use in semiconductor manufacturing plants exceeded 15.1 thousand acre-feet (TAF). Of this, approximately 70% is used in the production of ultrapure water (UPW*) for rinsing and washing during the fabrication process. Some studies suggest that the industry has made significant advances in water conservation, but evidence exists that opportunities still abound for improvements in more efficient water management. The manufacture of semiconductor devices begins by growing the silicon stock. The silicon stock is next cut into wafers of various diametersﾗ 6-inch (in), 8-in, and 12-in are typical. The wafers are then polished to prepare the surface for the next step, which is the etching of an integrated circuit into the wafer. Key to the success of this overall process is the rinsing and cleaning of the device with UPW to remove chemicals used in the etching process, and other impurities that would contaminate the device and reduce yield.

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