Ultrapure
Inhibition of Copper Corrosion by Removal of H2O2 from UPW Using Noble Metal Catalysts
By Daisaku Yano et al.
Abstract
Ultrapure water used in a semiconductor factory contains 10 to 40 micrograms per liter of hydrogen peroxide (H2O2). Through oxidation, organic impurities in UPW are decomposed by ultraviolet (UV) irradiation in a UPW polishing system. Hydroxyl radicals generated by UV light of a wavelength around 185 nanometer attack organics, but some of them combine each other to produce H2O2. The polishing system usually has a circulation loop, so H2O2 is accumulated. Copper corrosion can become a concern.
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