Achieving Ultra-Low-Level Measurement of Anions and Cations in Semiconductor High-Purity Water
By S.M. Rahmat Ullah et al.
High-purity water is of utmost importance in the semiconductor industry. Parameters such as silica, trace metals, total organic carbon (TOC), particles, anions and cations are monitored on a regular basis to ensure purity and system performance. The presence of anions and cations in semiconductor rinse water can cause various problems during wafer processing. For example, high levels of fluoride ions can cause uneven etching of the native oxide layer and chloride ions can cause corrosion of metal layers. Cations, such as sodium, potassium and calcium, can degrade electrical performance and cause significant yield loss. Additionally, ammonium-based compounds are known to cause haze on wafer surfaces (1).
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